Intel has demonstrated new architecture for its chip sets. The company has shared its strategy focused on six engineering segments. The company has demonstrated new 3D packaging technology called Fevros, which helps in improving the performance and power.(Vlsi Intenship companies)

Fevros is expected to extend die stacking. Where power delivery circuits can be fabricated in base die and high performance chip sets are stacked on top. Intel has also introduced its next generation Sunny cove architecture to increase performance and power efficiency.(Best VLSI training institute)

This architecture will be the base for Intel's next gen processors. Intel has recently talked about three new processors Ice lake, Lakefield and snow ridge which incorporate Intel's Fevros and Sunny cove technology. Other most anticipated processor( design verification training) launches in 2019 are AMD 3rd generation Ryzen/Threadripper (Zen 2) processors , AMD X570 chipset for Ryzen 3000 series, AMD Navi graphics card , Nvidia RTX 2060 and GTX 1160

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